天天快三彩票网51

  • Fan-in (FIWLP)
  • WLCSP

    (Bumping, Repassivation, RDL)
  • eWLCSP

    (encapsulated WLCSP)
  • Fan-out (FOWLP)
  • eWLB

    (embedded wafer level BGA)
  • 2.5D and 3D SiP eWLB

  • Integrated Passive Devices
  • IPD

  • Through Silicon Via
  • TSV for CIS

  • 天天快三彩票网51TSV for 3D IC

Highlights

天天快三彩票网51 Compact, high performance packages for rapidly shrinking product form factors

Proven leadership in innovative FOWLP solutions with over 1.7 Billion units shipped

天天快三彩票网51 Innovative 2D/2.5D/3D FOWLP packages with size, performance and cost advantages

Enhanced performance and size reduction with silicon IPDs

3D TSV capabilities covering mid-end-of-line through backend assembly and test

  • FOWLP SiP
  • Laminate FC SiP
  • Laminate FC + WB SiP
  • SiP Modules
  • Leadframe WB SiP
  • Laminate Stack Die WB SiP

Highlights

天天快三彩票网51 .Electronic system or sub-system integrates multiple active and passive components for higher performance, functionality, processing speeds and low cost

天天快三彩票网51 .Leading SiP technology portfolio incorporates all the key technical building blocks

Advanced design rules for 2.5D and 3D FOWLP or SiP configurations

天天快三彩票网51 High density SMT with high accuracy component placement

Advanced mold tech for complex topography SiP applications

天天快三彩票网51 Highly automated process modules

Tight process control to ensure consistency and high yield

天天快三彩票网51 .One stop turnkey solution - wafer to fully tested SiP modules

  • fcCuBE
  • fcFBGA
  • fcBGA
  • Bare die fcPoP
  • (flip chip package-on-package)

  • Molded Laser fcPoP
  • (flip chip package-on-package)

  • flip chip on Leadframe
  • (FCOL)

  • fcMIS
  • 天天快三彩票网51(flip chip on Molded interconnect System)

Highlights

天天快三彩票网51 Patented fcCuBE : proven low cost, high performance advanced flip chip technology

天天快三彩票网51 Fine pitch Cu pillar and Bond-on-Lead (BOL) interconnection for higher routing density at a lower cost Scalability to finer bump pitches, higher I/O and advanced fab nodes at a lower cost

天天快三彩票网51 High speed fcBGA-H offering for network/communication market fcPoP and hybrid flip chip + wirebond configurations for increased functional integration in a smaller form factor, and Pre-stacking of memory on logic for PoP packages

Leadership in low cost substrate technologies – Embedded Trace Substrate (ETS), Molded Interconnect System (MIS) and Single Layer laminate substrate

Wire Bond Package

  • PBGA
  • FBGA
  • (Side by Side,Stached Die)

  • Package-on-Package
  • MEMS
  • Memory Card
  • LGA

Highlights

天天快三彩票网51 Advanced wirebond technology in a cost competitive manufacturing location

天天快三彩票网51 Comprehensive range of single die, multi die, thermally enhanced and stacked die packages

天天快三彩票网51 Thin outline LGA suitable for high performance and/or portable applications

天天快三彩票网51 Low profile PoP provides flexibility in mixing and matching IC technologies in a thin package

Innovative process capabilities to enable MEMS and sensors chipset integration and fusion

Cost effective package approach for memory card formats

Laminate / Lead Frame

  • Discrete Packages:TO,SOD,FBP
  • Flip Chip on Leadframe(FCOL)
  • DIP
  • SOP
  • SOT
  • DFN
  • QFP
  • QFN-mr
  • QFN-dr
  • QFN

Highlights

Extensive experience in leadframe and discrete packages for a wide range of applications

天天快三彩票网51 Patented FCOL on MIS lead frame offers leading-edge QFN package for proven better

天天快三彩票网51 electrical and thermal performance, particularly in power management applications

MIS advantages

天天快三彩票网51 Ultra small, thin technology achieves product miniaturization

天天快三彩票网51 Superior RF, electrical, thermal and reliability performance

Fine line routing for high density I/O

天天快三彩票网51 Supports a wide range of wirebond, flip chip, SiP and PoP package configurations

Proven substrate technology with over 1B units shipped since 2010

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